When ordering high-quality PCBs from HONTEC, you'll find great value over time. We guarantee value for money through material specifications and quality control. And our quality control standards are far stricter than those of other suppliers and ensure that products perform as expected.
Even if there is no difference at first glance, a high-quality product ends up being a good value for money
At first glance, the PCB looks similar on the surface, regardless of its intrinsic quality. It is through the surface that we see the differences that are critical to the durability and functionality of the PCB throughout its life. Customers don't always see these differences, but they can rest assured that HONTEC makes every effort to ensure that the supplied PCBs meet the strictest quality standards.
It is critical that PCBs have reliable performance, both in the manufacturing assembly process and in actual use. In addition to the associated costs, defects in the assembly process may be brought into the final product by the PCB, which may fail during actual use, leading to claims. Therefore, from this point of view, it is no exaggeration to say that the cost of a good quality PCB is negligible.
In all market segments, especially those producing products in critical application areas, the consequences of such failures are disastrous.
These aspects should be kept in mind when comparing PCB prices. While reliable, guaranteed, and long-life products have a higher initial cost, they are worthwhile in the long run.
HONTEC's PCB Specifications Exceed IPC CLASS 2 Requirements
High Reliability Boards – 12 most important features selected from 103 features
1) 25 microns hole wall copper thickness
benefit
Enhanced reliability, including improved z-axis expansion resistance.
Risk of not doing so
Blow holes or outgassing, electrical connectivity issues during assembly (separation of inner layers, breakage of hole walls), or potential failure under load conditions in actual use. IPC Class 2 (the standard adopted by most factories) specifies 20% less copper plating.
2) No welding repair or open circuit repair
benefit
Perfect circuit for reliability and safety, no maintenance, no risk
Risk of not doing so
If not repaired properly, it will cause the circuit board to open circuit. Even if repaired 'properly', there is a risk of failure under load conditions (vibration, etc.) that may fail in actual use.
3) Exceed the cleanliness requirements of IPC specifications
benefit
Improved PCB cleanliness improves reliability.
Risk of not doing so
Residue, solder build-up on the circuit board poses a risk to the solder mask, ionic residue can cause corrosion and contamination of the solder surface, which can lead to reliability issues (bad solder joints/electrical failures) and ultimately increase the occurrence of actual failures probability.
4) Strictly control the service life of each surface treatment
benefit
Solderability, reliability, and reduced risk of moisture intrusion
Risk of not doing so
Solderability problems may occur due to metallographic changes in the surface treatment of older boards, while moisture intrusion may cause delamination, inner layer and hole wall separation (open circuit) problems during assembly and/or actual use .
5) Use internationally known substrates - do not use "local" or unknown brands
benefit
Improve reliability and known performance
Risk of not doing so
Poor mechanical properties mean that the board does not perform as expected in the assembled condition, for example: higher expansion properties can lead to delamination, open circuit and warpage problems. Impaired electrical properties can result in poor impedance performance.
6) CCL tolerances meet IPC4101 Class B/L requirements
benefit
Strict control of dielectric layer thickness can reduce deviations from expected values of electrical performance.
Risk of not doing so
The electrical performance may not meet the specified requirements, and the output/performance of the same batch of components may vary greatly.
7) Define solder mask material to ensure compliance with IPC-SM-840 Class T requirements
benefit
HONTEC recognizes "good" inks for ink safety and ensures solder mask inks meet UL standards.
Risk of not doing so
Poor quality inks can cause adhesion, flux resistance and hardness problems. All of these problems can cause the solder mask to detach from the board and eventually lead to corrosion of the copper circuit. Poor insulation properties can cause short circuits due to accidental electrical continuity/arcing.
8) Tolerances defining shapes, holes and other mechanical features
benefit
Tight tolerances improve product dimensional quality – improve fit, form and function
Risk of not doing so
Problems during assembly, such as alignment/mating (problems with press-fit pins are only discovered when assembly is complete). In addition, the mounting into the base can also be problematic due to increased dimensional deviations.
9) HONTEC specifies the thickness of the solder mask, although there is no relevant regulation by IPC
benefit
Improved electrical insulation properties, reduced risk of peeling or loss of adhesion, and increased resistance to mechanical shock – wherever it occurs!
Risk of not doing so
A thin solder mask can cause adhesion, flux resistance and hardness problems. All of these problems can cause the solder mask to detach from the board and eventually lead to corrosion of the copper circuit. Poor insulation properties due to thin solder mask, can cause short circuits due to accidental conduction/arcing.
10) HONTEC defines appearance requirements and repair requirements, although IPC does not
benefit
Safety is created with care and care in the manufacturing process.
Risk of not doing so
Various scratches, minor damages, patching and repairs - circuit boards work but don't look good. In addition to the problems that can be seen on the surface, what are the unseen risks, the impact on assembly, and the risks in actual use?
11) Requirements for the depth of the plug hole
benefit
High-quality plug holes will reduce the risk of failure during assembly.
Risk of not doing so
Chemical residues from the gold immersion process may remain in holes that are not fully plugged, causing problems such as solderability. In addition, there may also be tin beads hidden in the holes. During assembly or actual use, the tin beads may splash out and cause a short circuit.
12) Peters SD2955 designated peelable blue glue brand and model
benefit
The designation of peelable blue glue avoids the use of "local" or cheap brands.
Risk of not doing so
Poor or cheap peelables may foam, melt, crack or set like concrete during assembly, making the peelable/ineffective.
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Address：630 Entrepreneurial City, Xinghua Road, Xingwei, Fuyong, Baoan, ShenZhen, China
